Journal Articles

[J10]  . Global Placement Exploiting Soft 2D Regularity. ACM Transactions on Design Automation of Electronic Systems (TODAES), 2025. 

[J9]  . RapidStream 2.0: Automated Parallel Implementation of Latency Insensitive FPGA Designs Through Partial Reconfiguration. ACM Transactions on Reconfigurable Technology and Systems (TRETS), 2023. 

[J8]  . elfPlace: Electrostatics-based Placement for Large-Scale Heterogeneous FPGAs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2021. 

[J7]  . DREAMPlace: Deep Learning Toolkit-Enabled GPU Acceleration for Modern VLSI Placement. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2020.  (Best Paper Award)

[J6]  . ABCDPlace: Accelerated Batch-based Concurrent Detailed Placement on Multi-threaded CPUs and GPUs. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2020. 

[J5]  . A New Paradigm for FPGA Placement without Explicit Packing. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2018. 

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[J4]  . A Practical Split Manufacturing Framework for Trojan Prevention via Simultaneous Wire Lifting and Cell Insertion. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2018. 

[J3]  . UTPlaceF 2.0: A High-Performance Clock-Aware FPGA Placement Engine. ACM Transactions on Design Automation of Electronic Systems (TODAES), 2018.  (1st-Place Award of ISPD 2017 Contest)

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[J2]  . UTPlaceF: A Routability-Driven FPGA Placer with Physical and Congestion Aware Packing. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2017. 

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[J1]  . An Optimization Procedure for Coil Design in a Dual Band Wireless Power and Data Transmission System. ECS Transactions (ECST), 2013. 

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Conference Papers

More Publications

[C18]  . HeteroExcept: A CPU-GPU Heterogeneous Algorithm to Accelerate Exception-aware Static Timing Analysis. IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2024. 

[C17]  . SysMix: Mixed-Size Placement for Systolic-Array-Based Hierarchical Designs. IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2024. 

[C16]  . Calibration-Based Differentiable Timing Optimization in Non-linear Global Placement. ACM International Symposium on Physical Design (ISPD), 2024. 

[C15]  . Systolic Array Placement on FPGAs. IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2023. 

[C14]  . The 2023 MLCAD FPGA Macro Placement Benchmark Design Suite and Contest Results. ACM/IEEE Workshop on Machine Learning for CAD (MLCAD), 2023. 

[C13]  . General-Purpose Gate-Level Simulation with Partition-Agnostic Parallelism. ACM/IEEE Design Automation Conference (DAC), 2023. 

[C12]  . Global Placement Exploiting Soft 2D Regularity. ACM International Symposium on Physical Design (ISPD), 2022. 

[C11]  . FLOPS: Efficient On-Chip Learning for Optical Neural Networks Through Stochastic Zeroth-Order Optimization. ACM/IEEE Design Automation Conference (DAC), 2020. 

[C10]  . High-Definition Routing Congestion Prediction for Large-Scale FPGAs. IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), 2020. 

[C9]  . S3DET: Detecting System Symmetry Constraints for Analog Circuits with Graph Similarity. IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), 2020. 

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